首页> 外文期刊>IEEE Transactions on Applied Superconductivity >Fabrication of superconductor/semiconductor quasi-monolithicdevices using epitaxial liftoff technology
【24h】

Fabrication of superconductor/semiconductor quasi-monolithicdevices using epitaxial liftoff technology

机译:利用外延剥离技术制造超导体/半导体准单片器件

获取原文
获取原文并翻译 | 示例

摘要

This paper reports a study on the fabrication technology of high performance functional devices, where high temperature superconductor and compound semiconductor devices are monolithically integrated on the same substrate. We investigated optimal conditions for epitaxial liftoff process and succeeded in fabricating HTS device and GaAs MESFET on SrTiO 3 substrate without degrading characteristics of superconductor and semiconductor devices. We also carried out basic integrated circuit fabrication processes such as patterning and etching for quasi-monolithic structure. The results confirmed that fabricating high performance functional devices is feasible
机译:本文报道了对高性能功能器件制造技术的研究,其中高温超导体和化合物半导体器件单片集成在同一衬底上。我们研究了外延剥离工艺的最佳条件,并成功地在SrTiO 3衬底上制造了HTS器件和GaAs MESFET,而不会降低超导体和半导体器件的特性。我们还进行了基本的集成电路制造工艺,例如对准单片结构进行图案化和蚀刻。结果证实,制造高性能功能器件是可行的

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号