首页> 外文期刊>IEEE Transactions on Applied Superconductivity >Deposition of CeO2 buffer layers for YBCO coated conductors on biaxially textured Ni substrates by MOCVD technique
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Deposition of CeO2 buffer layers for YBCO coated conductors on biaxially textured Ni substrates by MOCVD technique

机译:MOCVD技术在双轴织构Ni衬底上沉积YBCO涂层导体的CeO2缓冲层

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CeO2 buffer layers for YBa2Cu3O7(YBCO) coated conductors were deposited on biaxially textured Ni substrates by metalorganic chemical vapor deposition (MOCVD) method. The variables were the oxygen partial pressure (PO2), deposition temperature and time. The [200] texture of CeO2 was formed at T = 500 °C - 520 °C, t = 3 - 15 min and PO2 = 2.30 torr, while the [111] and [200] texture were competitively formed at other condition. The surface roughness of CeO2 films was as good as 5 - 15 nm up to 500 °C, while it rapidly increased as a result of grain growth of the CeO2 at T ≥ 520 °C. The surface roughness of the CeO2 films also increased as the deposition time increased. The growth rate of the CeO2 films at T = 520 °C and PO2 = 2.30 torr was 200 nm/min, which is much higher than those prepared by other physical deposition methods.
机译:通过金属有机化学气相沉积(MOCVD)方法,将YBa2Cu3O7(YBCO)涂层导体的CeO2缓冲层沉积在双轴织构的Ni衬底上。变量是氧气分压(PO2),沉积温度和时间。 CeO2的[200]织构在T = 500°C-520°C,t = 3-15分钟,PO2 = 2.30托时形成,而[111]和[200]织构在其他条件下竞争形成。 CeO2薄膜的表面粗糙度在500°C时高达5-15 nm,而在T≥520°C时,由于CeO2的晶粒长大,其表面粗糙度迅速增加。 CeO 2膜的表面粗糙度也随着沉积时间的增加而增加。 CeO2薄膜在T = 520°C和PO2 = 2.30 torr时的生长速率为200 nm / min,这比通过其他物理沉积方法制备的生长速率要高得多。

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