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首页> 外文期刊>IEEE Transactions on Applied Superconductivity >Deposition of CeO/sub 2/ buffer layers for YBCO coated conductors on biaxially textured Ni substrates by MOCVD technique
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Deposition of CeO/sub 2/ buffer layers for YBCO coated conductors on biaxially textured Ni substrates by MOCVD technique

机译:MOCVD技术在双轴织构Ni衬底上沉积YBCO涂层导体的CeO / sub 2 /缓冲层

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摘要

CeO/sub 2/ buffer layers for YBa/sub 2/Cu/sub 3/O/sub 7/(YBCO) coated conductors were deposited on biaxially textured Ni substrates by metalorganic chemical vapor deposition (MOCVD) method. The variables were the oxygen partial pressure (P/sub O2/), deposition temperature and time. The [200] texture of CeO/sub 2/ was formed at T = 500 /spl deg/C - 520 /spl deg/C, t = 3 - 15 min and P/sub O2/ = 2.30 torr, while the [111] and [200] texture were competitively formed at other condition. The surface roughness of CeO/sub 2/ films was as good as 5 - 15 nm up to 500 /spl deg/C, while it rapidly increased as a result of grain growth of the CeO/sub 2/ at T /spl ges/ 520 /spl deg/C. The surface roughness of the CeO/sub 2/ films also increased as the deposition time increased. The growth rate of the CeO/sub 2/ films at T = 520 /spl deg/C and P/sub O2/ = 2.30 torr was 200 nm/min, which is much higher than those prepared by other physical deposition methods.
机译:通过金属有机化学气相沉积(MOCVD)方法在双轴织构的Ni基板上沉积用于YBa / sub 2 / Cu / sub 3 / O / sub 7 /(YBCO)的导体的CeO / sub 2 /缓冲层。变量是氧气分压(P / sub O2 /),沉积温度和时间。 CeO / sub 2 /的[200]织构在T = 500 / spl deg / C-520 / spl deg / C,t = 3-15分钟,P / sub O2 / = 2.30 torr时形成,而[111] ]和[200]纹理在其他条件下竞争形成。 CeO / sub 2 /薄膜的表面粗糙度在500 / spl deg / C时高达5-15 nm,而由于CeO / sub 2 /在T / spl ges / 520 / spl摄氏度/℃。 CeO / sub 2 /膜的表面粗糙度也随着沉积时间的增加而增加。 CeO / sub 2 /薄膜在T = 520 / spl deg / C和P / sub O2 / = 2.30托时的生长速率为200 nm / min,这比通过其他物理沉积方法制备的高得多。

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