机译:用电镀铜电镀制备的W-Cu纳米复合粉的相位,形态,机械和腐蚀性能的影响
Materials Engineering Department Faculty of Engineering Malayer University Malayer Iran;
Materials Engineering Department Faculty of Engineering Malayer University Malayer Iran;
Materials Engineering Department Faculty of Engineering Malayer University Malayer Iran;
Materials Engineering Department Faculty of Engineering Malayer University Malayer Iran;
Materials Engineering Department Faculty of Engineering Malayer University Malayer Iran;
Materials Engineering Department Faculty of Engineering Malayer University Malayer Iran;
Electroless copper plating; Tungsten; Surface activation; NaOH; Mechanical properties; corrosion behavior;
机译:简化的预处理工艺对化学镀W-Cu复合粉末形貌的影响及其烧结特性
机译:工艺参数对氢化脉冲Ti6Al4V粉体的电磁脉冲压实成型体密度和力学性能的影响
机译:工艺参数对氢化脉冲Ti6A14V粉体的电磁脉冲压实成型体密度和力学性能的影响
机译:具有高强度和电导率的W-Cu / Lu_2O_3复合材料的制造和粉末冶金制备
机译:在肼溶液中在不锈钢基材上化学镀钯:镀液参数,沉积机理和沉积形态之间关系的研究。
机译:摩擦搅拌法制备的新型Ti-6V-4V /锌表面纳米复合材料的微观结构力学和生物学性能
机译:工艺参数对固体氧化物燃料电池机械制备的复合粉末电化学性能的影响