ELECTROLESS PLATING METHOD FOR CONTROLLING THE THICKNESS OF COPPER PLATING AT ONE TIME DURING AN ELECTROLESS COPPER PLATING PROCESS

摘要

PURPOSE: An electroless plating method is provided to manufacture an antenna with good RF characteristics by plating an object with uniform thickness of copper.;CONSTITUTION: An electroless plating method comprises a pretreatment process, a catalyst treatment process, and an electroless copper plating process. The pretreatment process comprises a cleaner process, in which an object is dipped in a cleaner treatment liquid of 20-50°C for 30 seconds to 5 minutes in order to remove foreign materials from the surface of the object, and an ultrasonic degreasing process, in which buff gas is removed from the surface of the object. The cleaner treatment liquid is prepared by mixing 5-10wt.% of sodium bisulfite and 1-5wt.% of H2SO4(Sulfuric Acid) into 85-90wt.% of pure water. The catalyst treatment process includes a first catalyst treatment step for treating the object so that electroless copper adheres to the surface of the object. The electroless copper plating process includes a copper plating thickness control step for forming uniform thickness of a coating film on a circuit pattern of the object.;COPYRIGHT KIPO 2012