Thickness Distribution Calculation of Electroplating to a Resistive Electrode- Electrolytic Copper Plating to Electroless Copper Plating

摘要

We have developed and sold the current distribution analysis program “Electroplating PilotrnSystems (EPPS)” of electrochemical cells. The last lecture convention reported the effect whichrnincluded the iteration method high-speed solution of the finite element method in the analysisrnprogram. However, if the iteration method high-speed solution was used for the analysis of arnresistive electrode, convergence was difficult and great computation time was required. In order tornanalyze a resistive electrode efficiently, the direct method high-speed solution without convergencerncalculation was incorporated. As a result, analysis of a three dimension resistive electrode has madernfor a short time. The thickness distribution of electroplating to electroless plating on plastic can berncalculated, and analysis can be utilized for examination of the position of current supplying points.