溶胶-喷雾干燥法制备的 W-Cu 纳米复合粉末的烧结致密化与晶粒长大

摘要

采用溶胶−喷雾干燥法制备 W-25Cu、W-30Cu 纳米复合粉末，在1300~1420℃下烧结15~120 min，得到 W-25Cu 和 W-30Cu 复合材料，对该复合粉末的致密化和钨晶粒长大行为进行研究。结果显示，随烧结时间延长或烧结温度升高，W-25Cu 和 W-30Cu 复合材料更加致密，在1420℃下烧结120 min 后接近全致密，相对密度分别为98.09%和99.13%。W-25Cu、W-30Cu 复合材料在1380℃烧结30~120 min 的晶粒长大符合溶解–析出机制，烧结温度对晶粒长大的影响较成分影响更大。在1420℃烧结120 min 后，W-25Cu 和 W-30Cu 的晶粒尺寸分别为1.17μm 和1.13μm。%W-25Cu/W-30Cu composite powders fabricated by sol-spray drying method were sintered at 1 300~1 420 ℃for 15~120 min. The densification and grain growth behavior of the composite were studied. The results show that, the densification of W-25Cu/W-30Cu composite gradually increases with increasing sintering time and temperature. The relative density of W-25Cu and W-30Cu composite materials sintered at 1 420 ℃ for 120 min are 98.09% and 99.13%, respectively, which approach to the full theoretical density. Meanwhile, the grain growth of W-25Cu/W-30Cu composite sintered at 1 380 ℃ for 30~120 min is in accord with dissolved-precipitation mechanism, and the effect of sintering temperature on grain growth is more significant than that of the composition. After sintering at 1 420 ℃ for 120min, the grain size of W-25Cu and W-30Cu are 1.17 μm and 1.13 μm, respectively.