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Scalable growth of free-standing graphene wafers with copper(Cu) catalyst on SiO2/Si substrate: Thermal conductivity of the wafers

机译:SiO2 / Si衬底上具有铜(Cu)催化剂的自支撑石墨烯晶片的可扩展生长:晶片的导热性

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The authors report scalable growth of free-standing graphene wafers with copper(Cu) catalyst on SiO2/Si substrate at low temperature and investigation of their thermal conductivity. The Cu is the most common and the cheapest catalyst among electronic materials. Our process for producing the graphene with the Cu is based on a low-pressure, fast-heating chemical vapor deposition method. Thermal conductivity measurements with nondestructive Raman spectroscopy showed that the free-standing-graphene is a good thermal conductor. The possibility of growing graphene wafer at low temperatures by using a Cu thin film should accelerate research and facilitate the development of graphene for practical applications
机译:作者报告了在SiO2 / Si衬底上具有铜(Cu)催化剂的独立式石墨烯晶片在低温下可扩展生长,并研究了其导热性。在电子材料中,Cu是最常见,最便宜的催化剂。我们使用铜生产石墨烯的工艺基于低压,快速加热的化学气相沉积方法。使用非破坏性拉曼光谱仪进行的热导率测量表明,独立式石墨烯是良好的导热体。通过使用Cu薄膜在低温下生长石墨烯晶圆的可能性将加速研究并促进石墨烯在实际应用中的开发

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  • 来源
    《Applied Physics Letters》 |2010年第8期|共页
  • 作者

    Lee Yun-Hi; Lee Jong-Hee;

  • 作者单位

    Department of Physics, National Research Laboratory for Nano Device Physics, Korea University, Seoul 136-713, Republic of Korea;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
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