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Electron mobility in Ge and strained-Si channel ultrathin-body metal-oxide semi conductor field-effect transistors

机译:Ge和应变Si沟道超薄金属氧化物半导体场效应晶体管中的电子迁移率

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Electron mobility in strained silicon and various surface oriented germanium ultrathin-body (UTB) metal-oxide semiconductor field-effect transistors (MOSFETs) with sub-10-nm-body thickness are systematically studied. For biaxial tensile strained-Si UTB MOSFETs, strain effects offer mobility enhancement down to a body thickness of 3 nm, below which strong quantum confinement effect renders further valley splitting via application of strain redundant. For Ge channel UTB MOSFETs, electron mobility is found to be highly dependent on surface orientation. Ge<100> and Ge<110> surfaces have low quantization mass that leads to a lower mobility than that of Si in aggressively scaled UTB MOSFETs. (C) 2004 American Institute of Physics.
机译:系统研究了应变硅和体表厚度小于10nm的各种表面取向锗超薄体(UTB)金属氧化物半导体场效应晶体管(MOSFET)中的电子迁移率。对于双轴拉伸应变Si UTB MOSFET,应变效应可提供低至3 nm的主体厚度的迁移率增强,在该厚度以下,强的量子限制效应可通过施加应变冗余来进一步降低波谷。对于锗通道UTB MOSFET,发现电子迁移率高度依赖于表面取向。 Ge <100>和Ge <110>表面具有较低的量化质量,从而导致其迁移率远低于积极缩放的UTB MOSFET中的Si迁移率。 (C)2004美国物理研究所。

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