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Device physics and guiding principles for the design of double-gate tunneling field effect transistor with silicon-germanium source heterojunction

机译:硅锗源异质结双栅隧穿场效应晶体管设计的器件物理和指导原则

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The device physics and guiding principles for the design of the double-gate tunneling field-effect transistor with silicon-germanium (SiGe) heterojunction source are discussed. Two dimensional device simulations were employed to study the influence of the position of the SiGe/Si heterojunction on band-to-band tunneling and device performance. It is established that band-to-band tunneling occurs at a distance of ~4 nm from the gate edge in the source region. In order for the narrower bandgap of SiGe to play a dominant role, the overlap between the SiGe region and the gate should be such that the whole tunneling path of the electrons is located in SiGe. To harness the maximum benefits of the high band-to-band tunneling rate in SiGe, an overlap of ~2 nm between the SiGe region and the gate would be required.
机译:讨论了硅锗(SiGe)异质结源双栅隧穿场效应晶体管设计的器件物理原理和指导原则。利用二维器件仿真研究了SiGe / Si异质结的位置对带间隧穿和器件性能的影响。可以确定,在源区中距栅极边缘约4 nm处发生了带间隧穿。为了使SiGe的窄带隙起主导作用,SiGe区域和栅极之间的重叠应使电子的整个隧穿路径位于SiGe中。为了充分利用SiGe中的高带间隧穿速率的最大好处,在SiGe区域和栅极之间需要〜2 nm的重叠。

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