首页> 外国专利> SILICON-GERMANIUM HETEROJUNCTION TUNNEL FIELD EFFECT TRANSISTOR AND PREPARATION METHOD THEREOF

SILICON-GERMANIUM HETEROJUNCTION TUNNEL FIELD EFFECT TRANSISTOR AND PREPARATION METHOD THEREOF

机译:硅锗异质结隧道场效应晶体管及其制备方法

摘要

A silicon/germanium (SiGe) heterojunction Tunnel Field Effect Transistor (TFET) and a preparation method thereof are provided, in which a source region of a device is manufactured on a silicon germanium (SiGe) or Ge region, and a drain region of the device is manufactured in a Si region, thereby obtaining a high ON-state current while ensuring a low OFF-state current. Local Ge oxidization and concentration technique is used to implement a Silicon Germanium On Insulator (SGOI) or Germanium On Insulator (GOI) with a high Ge content in some area. In the SGOI or GOI with a high Ge content, the Ge content is controllable from 50% to 100%. In addition, the film thickness is controllable from 5 nm to 20 nm, facilitating the implementation of the device process. During the oxidization and concentration process of the SiGe or Ge and Si, a SiGe heterojunction structure with a gradient Ge content is formed between the SiGe or Ge and Si, thereby eliminating defects. The preparation method according to the present invention has a simple process, which is compatible with the CMOS process and is applicable to mass industrial production.
机译:提供了一种硅锗锗异质结隧道场效应晶体管及其制备方法,其中,在硅锗或锗区上制造器件的源区,并在硅锗区上制备器件的源区。在Si区域中制造该器件,从而在确保低截止状态电流的同时获得高导通状态电流。使用局部Ge氧化和浓缩技术来实现某些区域中具有高Ge含量的绝缘硅锗(SGOI)或绝缘锗锗(GOI)。在具有高Ge含量的SGOI或GOI中,Ge含量可控制在50%至100%之间。另外,膜厚度可控制在5nm至20nm,从而有利于器件工艺的实施。在SiGe或Ge和Si的氧化和浓缩过程中,在SiGe或Ge和Si之间形成具有梯度Ge含量的SiGe异质结结构,从而消除了缺陷。本发明的制备方法工艺简单,与CMOS工艺兼容,适用于大规模工业生产。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号