Growth of continuous and ultrathin platinum films on tungsten adhesion layers using atomic layer deposition techniques

摘要

Continuous and ultrathin platinum (Pt) films were deposited on tungsten (W) adhesion layers using atomic layer deposition (ALD) techniques. Pt ALD films were deposited at 120 °C using MeCpPtMe_3 and H_2 plasma as the reactants. X-ray reflectivity studies observed the rapid nucleation of the Pt film. X-ray photoelectron results were consistent with layer-by-layer growth suggesting a continuous Pt film at thicknesses > 1.5 nm. The high surface energy of the W ALD adhesion layer enables the growth of continuous and ultrathin films of lower surface energy metals and should facilitate the use of precious metals for a variety of applications.