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Low-resistance gateless high electron mobility transistors using three-dimensional inverted pyramidal AlGaN/GaN surfaces

机译:使用三维倒金字塔锥体AlGaN / GaN表面的低电阻无栅极高电子迁移率晶体管

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摘要

In this letter, three-dimensional gateless AlGaN/GaN high electron mobility transistors (HEMTs) were demonstrated with 54% reduction in electrical resistance and 73% increase in surface area compared with conventional gateless HEMTs on planar substrates. Inverted pyramidal AlGaN/ GaN surfaces were microfabricated using potassium hydroxide etched silicon with exposed (111) surfaces and metal-organic chemical vapor deposition of coherent AlGaN/GaN thin films. In addition, electrical characterization of the devices showed that a combination of series and parallel connections of the highly conductive two-dimensional electron gas along the pyramidal geometry resulted in a significant reduction in electrical resistance at both room and high temperatures (up to 300 ℃). This three-dimensional HEMT architecture can be leveraged to realize low-power and reliable power electronics, as well as harsh environment sensors with increased surface area.
机译:在这封信中,与平面基板上的传统无栅极HEMT相比,三维无栅极AlGaN / GaN高电子迁移率晶体管(HEMT)的电阻降低了54%,表面积增加了73%。使用具有暴露的(111)表面的氢氧化钾蚀刻硅和相干的AlGaN / GaN薄膜的金属有机化学气相沉积法,可对倒金字塔形的AlGaN / GaN表面进行微细加工。此外,器件的电气特性表明,沿锥体几何结构的高传导性二维电子气的串联和并联连接导致在室温和高温(最高300℃)下电阻均显着降低。 。可以利用这种三维HEMT架构来实现低功率和可靠的功率电子器件,以及具有增加的表面积的恶劣环境传感器。

著录项

  • 来源
    《Applied Physics Letters》 |2016年第1期|012104.1-012104.4|共4页
  • 作者

    Hongyun So; Debbie G. Senesky;

  • 作者单位

    Department of Aeronautics and Astronautics, Stanford University, Stanford, California 94305, USA;

    Department of Aeronautics and Astronautics, Stanford University, Stanford, California 94305, USA,Department of Electrical Engineering, Stanford University, Stanford, California 94305, USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

  • 入库时间 2022-08-18 03:14:36

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