首页> 外文会议>Meeting of the Electrochemical Society;International Meeting on Chemical Sensors >The Development of a New Ion Versus Log(Ig) Plot to Characterize Depletion-Mode High Electron Mobility Transistors with the Insertion of a Very Thin Evaporated Al Layer to AlGaN/GaN High Electron Mobility Transistors as an Example
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The Development of a New Ion Versus Log(Ig) Plot to Characterize Depletion-Mode High Electron Mobility Transistors with the Insertion of a Very Thin Evaporated Al Layer to AlGaN/GaN High Electron Mobility Transistors as an Example

机译:新的离子与log(Ig)图的开发,以表征耗尽模式高电子迁移率晶体管,随着将非常薄的蒸发的Al层插入AlGaN / GaN高电子迁移率晶体管作为示例

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Previously, we showed that the Id_on vs. log Id_off plot can be used to characterize silicon-based enhancement-mode MOS transistors for both p-channel and n-channel. AlGaN/GaN high electron mobility transistors (HEMTs) have attracted world-wide interest for microwave power transistor applications. There are two kinds of AlGaN/GaN HEMTs: depletion-mode and enhancement-mode AlGaN/GaN HEMTs. In general, depletion-mode AlGaN/GaN HEMTs are more common. For depletion-mode devices with the source at 0 V, even though the gate voltage may be close to zero, the gate leakage current increases with the increase of the drain voltage and can be significant because of a large drain voltage. Thus the gate leakage current may limit the maximum drain voltage and thus the RF power output of the device. For depletion-mode high electron mobility transistors (HEMTs), it can be easily imagined that both the on current (Ion) and the gate leakage current (Ig) will be increased by using a low work function metal as gate metal. Thus the drain on current (Id_on) and the gate leakage current (Ig) alone will not be a good criterion to judge the quality of depletion-mode HEMTs. In this paper, we would like to propose the application of a new Id_on vs. log Ig plot to characterize depletion-mode HEMTs. In the literature, a lot of various approaches have been proposed to cut down the gate leakage current. Recently, Nanjo et al. proposed to use a thin Al layer inserted between AlGaN and the Schottky metal gate to reduce the gate leakage current. The advantage of this approach was subsequently confirmed by Selvaraj and Egawa; however, they emphasized on the increase of the drain current instead of the reduction in the gate leakage current. It is natural to wonder how Al insertion can ever increase the drain current. Hence, the physics behind this approach is not yet clear. In this paper, we will also propose our theory regarding the physics of Al gate for AlGaN/GaN HEMT's. With the help of this new plot, the superiority of the sample with Al/Ni/Au gate compared to the control sample with Ni/Au gate can be easily seen because the on current is higher for the same gate leakage current.
机译:以前,我们展示了ID_ON与日志ID_OFF曲线图用于表征用于P沟道和N沟道的基于硅的增强模式MOS晶体管。 AlGaN / GaN高电子迁移率晶体管(HEMTS)吸引了全球对微波功率晶体管应用的兴趣。 AlGaN / GaN Hemts有两种:耗尽模和增强模式Algan / GaN Hemts。通常,耗尽模式AlGaN / GaN Hemts更常见。对于具有0V的源极的耗尽模式装置,即使栅极电压可能接近零,栅极漏电流随着漏极电压的增加而增加,并且由于大的漏极电压而可能是显着的。因此,栅极泄漏电流可以限制最大漏极电压,从而限制器件的RF功率输出。对于耗尽模式高电子迁移率晶体管(HEMTS),可以通过使用低功函数金属作为栅极金属来增加电流(离子)和栅极漏电流(Ig)。因此,单独的电流(ID_ON)和栅极泄漏电流(Ig)的漏极不是良好的标准,以判断耗尽模式HEMT的质量。在本文中,我们想提出新的ID_ON与Log IG图的应用,以表征耗尽模式HEMT。在文献中,已经提出了许多各种方法来减少栅极漏电流。最近,Nanjo等人。提出使用插入AlGaN和肖特基金属栅极之间的薄Al层,以减小栅极漏电流。随后由Selvaraj和Egawa确认这种方法的优点;然而,它们强调漏极电流的增加而不是栅极漏电流的减少。很自然地想知道Al插入如何增加漏极电流。因此,这种方法背后的物理尚不清楚。在本文中,我们还将提出我们关于AlGan / GaN Hemt的Al Gate的物理学的理论。借助于这种新的曲线,可以容易地看到与使用Ni / Au门的控制样品与Al / Ni / Au门的样品的优越性可以很容易地看到,因为相同的栅极漏电流的电流较高。

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