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System integration of high voltage electrostatic MEMS actuators

机译:高压静电MEMS执行器的系统集成

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A system integration for High Voltage (HV) electrostatic MicroElectroMechanical Systems (MEMS) actuators is introduced on a micro-Printed Circuit Board. The system includes a programmable microcontroller, a programmable DC/DC converter, a multi output HV interface and electrostatic MEMS actuators. The system produces high output voltages (10–300 V) and can control a large variety of MEMS capacitive loads (1 to 50 pF) by combining diverse semiconductor technologies. This system proves that technologies, such as low voltage CMOS of different processes, high voltage DMOS and MEMS, can interact, communicate and even be integrated as a System In Package (SIP), providing significant size and cost reductions. The system was programmed to control electrostatic MEMS actuator. The DC/DC converter was made from components of different technologies and two addressable high voltage CMOS interfaces were fabricated with DALSA's 0.8 μm High Voltage process. A prototype of the global system has been built and tested.
机译:在微型印刷电路板上引入了用于高压(HV)静电微机电系统(MEMS)执行器的系统集成。该系统包括一个可编程的微控制器,一个可编程的DC / DC转换器,一个多输出HV接口和静电MEMS执行器。该系统产生高输出电压(10–300 V),并且可以通过结合多种半导体技术来控制各种MEMS电容负载(1至50 pF)。该系统证明,诸如不同工艺的低压CMOS,高压DMOS和MEMS之类的技术可以交互,通信,甚至可以集成为系统级封装(SIP),从而大大降低了尺寸并降低了成本。该系统被编程为控制静电MEMS执行器。 DC / DC转换器由不同技术的组件制成,并采用DALSA的0.8μm高压工艺制造了两个可寻址的高压CMOS接口。已构建并测试了全球系统的原型。

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