Flip Chip and BGA Solder Joint Reliability

摘要

Moire interferometry was found to be a reliable technique to measure the in-situ deformation of solder joints under electrical current stressing. High-current density through solder joints causes solder joint deformation. Based on more Moire experiments on BGA solder joints and microstructural tests on flip chip solder joints, a constitutive model is proposed to predict the strain-stress evolution of solder joints under current stressing. With this constitutive model, FE numerical simulations can be implemented to predict solder ball reliability under current stressing.