Production manner of the ball terminal and the tape for flip chip BGA, and the tape for this BGA which possess suteihuna, the semiconductor equipment and its production manner null of the flip chip structure which uses the tape for this BGA

摘要

PROBLEM TO BE SOLVED: To manufacture a semiconductor device having a flip chip structure using a tape for flip chip BGA (ball grip allay) with ball terminals and a stiffener which can enhance the productivity without degrading the reliability of a package even if a tape made of polyimide resin with a high liquid absorption is used. ;SOLUTION: A tape for flip chip BGA having ball terminals 5 and a stiffener 7 is produced by firstly providing the stiffener 7 which is bonded to a surface of a flexible wiring tape 6, forming a wiring pattern, inner leads 8 and a land for forming ball terminals on a copper foil which is bonded to the other surface of the flexible wiring tape 6, and mounting the ball terminals 5 on the land for forming the ball terminals. After that a semiconductor chip is mounted on the inner leads which are formed on a polyimide film 6 of the tape for flip chip BGA.;COPYRIGHT: (C)1999,JPO