Production manner null of the TAB tape for BGA

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a TAB(tape automated bonding) tape for BGA (pole grid array) wherein a via hole is formed with the same mold without depending on the pattern form of the via hole of the TAB tape for BGA. ;SOLUTION: A TAB tape 21a for BGA is clamped by a tape feeding means 36. The tape feeding means is fed by an amount of formation pitch for a via hole of 1 piece amount, and a punching-out means 30 forms the via hole on the TAB tape for BGA. The process is repeated to complete forming the via hole of 1 piece amount. Then the clamp of the TAB tape for BGA is released. The tape feeding means is retreated by the total amount of above feeding added with the formation pitch of the via hole of an adjacent piece. Then the TAB tape for BGA is clamped again. The tape feeding means is fed by the amount of second pitch so that the via holes are continuously punched out on the TAB tape for BGA.;COPYRIGHT: (C)2001,JPO