Computational parametric analyzes on the solder joint reliability of bottom leaded plastic (BLP) package

摘要

The bottom-leaded plastic (BLP) package is a lead-on-chip type of chip scale package (CSP) developed mainly for memory devices. Because the BLP package is one of the smallest plastic packages available, solder joint reliability becomes a critical issue. In this study, a 28-pin BLP package is modeled to investigate the effects of molding compound and leadframe material properties, the thickness of printed circuit board (PCB), the shape of solder joint and the solder pad size on the board level solder joint reliability. A viscoplastic constitutive relation is adopted for the modeling of solder in order to account for its time and temperature dependence on thermal cycling. A three-dimensional nonlinear finite element analysis based on the above constitutive relation is conducted to model the response of a BLP assembly subjected to thermal cycling. The fatigue life of the solder joint is estimated by the modified Coffin-Manson equation. The two coefficients in the modified Coffin-Manson equation are also determined. Parametric studies are performed to investigate the dependence of solder joint fatigue life on various design factors.