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Mold assembly for a package stack via bottom-leaded plastic (blp) packaging
Mold assembly for a package stack via bottom-leaded plastic (blp) packaging
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机译:通过底部引线塑料(blp)封装进行封装堆叠的模具组装
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摘要
A packaged semiconductor device has bottom surface leads having portions of the package adjacent the lead edges excised. The outer leads may take the form of inverted-J leads, short stub leads, vertically bent leads-in-grooves, or may be entirely eliminated. Lead connections are on the bottom package surface, over the top package surface, and/or on the sides and ends of the package, enabling vertical stacking of the devices and simultaneous/alternative coplanar horizontal connections to other semiconductor devices, circuit boards, etc. A mold assembly with a castellated inner surface forms a package with alternating grooves and columns for holding side and end electrical connection surfaces.
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