Prediction of Losses Caused by Roughness of Metallization in Printed-Circuit Boards

摘要

In this paper, the effect of metal roughness on the total loss, the extracted tandelta, and signal integrity of typical interconnections found in printed-circuit boards is extracted from measurements on three different materials. The differing characteristics of the roughened metal cross sections are highlighted, and a simplified, practical, 2-D, causal, broadband modeling methodology is shown