电载荷作用下温度对微焊点界面扩散的影响

摘要

以Cu/SAC305/Cu为研究对象,研究温度对电迁移过程中界面金属间化合物(IMC)生长及Cu焊盘消耗的影响.试验过程中加载的电流密度为0.76×104A/cm2,试验温度分别为100、140、160和180 °C.分别建立焊点阴极Cu焊盘消耗及阳极界面IMC厚度的本构方程.在电迁移过程中,焊点阴极Cu焊盘消耗量与加载时间呈线性关系,Cu焊盘消耗速率与试样温度呈抛物线关系.阳极界面IMC厚度与加载时间的平方根呈线性关系,且界面IMC的生长速率与试样温度呈抛物线关系.在电迁移过程中,阳极界面IMC生长与阴极Cu焊盘消耗有不同的变化规律,这是由于电流作用下焊点体钎料内形成了大量的IMC.%The effects of temperature on Cu pad consumption and intermetallic compound (IMC) growth were investigated under current stressing. The Cu/Sn-3.0Ag-0.5Cu (SAC305)/Cu solder joints were used, with a certain current density of 0.76×104A/cm2at 100, 140, 160 and 180 °C. The constitutive equations of cathode Cu pad consumption and anode interface IMC growth are established, respectively, based on the loading time and sample temperature. The cathode Cu pad consumption (δ)increases linearly with the loading time and the consumption rate shows parabolic curve relationships with sample temperature. The anode interface IMC thickness (δ1)increased is linearly with the square root of loading time and the interface IMC growth coefficient shows parabolic curve relationship with sample temperature. Theδ andδ1have different variation laws under current stressing, due to the current facilitating larger amount of IMC formation in the bulk solder.