Effect of bump shape on current density and temperature distributions in solder bump joints under electromigration

摘要

Three dimensional thermo-electrical finite element analysis was employed to simulate the current density and temperature distributions for solder bump joints with different bump shapes. Mean-time-to-failure (MTTF) of electromigration was discussed. It was found that as the bump volume increased from hourglass bump to barrel bump, the maximum current density increased but the maximum temperature decreased. Hourglass bump with waist radius of 240 μm has the longest MTTF.