厚铜PCB用高填充性半固化片的研制

摘要

Generally, the higher Resin Content of 106 prepreg（pp） is just about 75%. The clearances between the eireuitries ofthiek copper （more than 3 oz, including 3 oz） printed circuit board need much more resin to fill. So, the prepreg which is manufactured by normal process is difficult to fill the thick copper printed circuit board very well. So this article is set to research new method of process of increasing resin content of prepreg, and improve the filling resin capacity of the prepreg to the thick copper printed circuit board.%一般地，106半固化片的树脂含量（简称RC）只能达到75％左右。因厚铜（铜厚达到105μm及以上）印制电路板的线路间需要更多的树脂来填充，故普通工艺制造的半固化片就很难满足厚铜印制线路板的填胶性。因此，本文研究了提高半固化片RC的新工艺方法，从而改善半固化片对厚铜印制线路板的填胶性能。