蓝宝石衬底基片表面平整加工工艺研究

摘要

重点探讨了蓝宝石衬底基片表面平整加工工艺方案,并开展了表面平整加工工艺的实验研究.采用形状测量激光显微系统、接触式测厚仪等,对平整加工工艺各阶段的表面形貌、表面粗糙度Ra、翘曲度、平整度及加工去除量等进行测量和对比分析.结果表明:随着本实验平整加工工艺方案的进行,蓝宝石衬底基片的表面质量不断提高,最终获得了超光滑无损伤镜面表面,化学机械抛光后的衬底表面粗糙度Ra达0.3nm,翘曲度为3.8 μm,平整度为1.5μm,符合蓝宝石衬底基片超精密加工的表面质量要求.%This paper focused on the planarization process of sapphire substrate surface,and carried out the experimental research about the planarization process. The surface morphology, surface roughness Ra, warpage, flatness and processing removal of each stage were measured and compared by using the shape measurement laser microscopy system and the contact thickness gauge. The results showthat sapphire substrate surface quality continues to increase by the planarization process, The super smooth mirror surface without damage be got at last,after chemical mechanical polishing,the surface roughness Ra was 0.3nm,the warpage was 3.8μm,and the flatness was 1.5μm,which conformed to the sapphire substrate processed by,the flattening process.All of these meet the surface quality requirements for ultra-precision machining.