小型精密CVD金刚石热沉片的制备研究

摘要

CVD diamond film is an excellent material for thermal conductivity. It has broad application prospect of heat sink in microelectronic field. The mould copy technique is used to deposit the miniature precision diamond heat sinks. ICP etching processes are used to prepare the silicon moulds. The temperature field and the gas flow field in CVD deposition system are analyzed by use of Fluent simulation. The miniature diamond heat sinks are deposited in silicon moulds. The results show that favorable surface structure, high shape and size precision heat sinks are gained by the mould copy technique.%CVD金刚石具有优异的导热性能,在微电子热沉应用方面有着广阔的应用前景.利用ICP工艺制造了硅模具,利用有限元对CVD系统中硅模具的温度场和流场进行了研究,在硅模具内制备了小型精密CVD金刚石热沉片.试验结果表明模具法能够获得表面品质好、形状和尺寸精度很高的小型金刚石热沉片.