首页> 外国专利> METHOD FOR MANUFACTURING JOINED BODY, METHOD FOR MANUFACTURING HEAT SINK-EQUIPPED POWER MODULE SUBSTRATE, METHOD FOR MANUFACTURING HEAT SINK, JOINED BODY, HEAT SINK-EQUIPPED POWER MODULE SUBSTRATE, AND HEAT SINK

METHOD FOR MANUFACTURING JOINED BODY, METHOD FOR MANUFACTURING HEAT SINK-EQUIPPED POWER MODULE SUBSTRATE, METHOD FOR MANUFACTURING HEAT SINK, JOINED BODY, HEAT SINK-EQUIPPED POWER MODULE SUBSTRATE, AND HEAT SINK

机译:制造接合体的方法,制造具有热沉的功率模块基体的方法,制造散热片,接合体,具有热沉的功率模块基体和热沉的方法

摘要

PROBLEM TO BE SOLVED: To provide a joining method for a joined body, by which a joined body arranged by appropriately joining an aluminum alloy member including an aluminum alloy relatively low in solidus temperature, and a metal member including copper, nickel or silver to each other, and having a low heat resistance in a laminating direction can be manufactured.SOLUTION: A method for manufacturing a joined body arranged by joining a metal member including copper, nickel or silver, and an aluminum alloy member including an aluminum alloy of which the solidus temperature is under an eutectic temperature of aluminum and the metal element included in the metal member to each other comprises: an aluminum alloy member/aluminum interposing layer solid-phase diffusion-joining step S05 where an aluminum interposing layer made of aluminum with a purity of 99 mass% or higher is disposed between the aluminum alloy member and the metal member, and the aluminum alloy member and the aluminum interposing layer are joined to each other by solid-phase diffusion; and an aluminum interposing layer/metal member solid-phase diffusion joining step S04 where the aluminum interposing layer and the metal member are joined to each other by solid-phase diffusion.SELECTED DRAWING: Figure 2
机译:解决的问题:提供一种用于接合体的接合方法,通过该接合方法,通过适当地接合包括固相线温度较低的铝合金的铝合金构件和包含铜,镍或银的金属构件来适当地布置接合体。解决方案:一种用于制造接合体的方法,该接合体通过将包含铜,镍或银的金属构件与包含铝合金的铝合金构件接合而布置。固相线温度是在铝的共晶温度下,并且金属构件中包含的金属元素彼此包括:铝合金构件/铝插入层固相扩散接合步骤S05,其中由纯铝制成的铝插入层在铝合金构件与金属构件之间,铝合金构件与铝插入物之间配置有99质量%以上的材料。振荡层通过固相扩散相互结合。铝插入层/金属构件固相扩散接合步骤S04,其中铝插入层和金属构件通过固相扩散相互接合。图2

著录项

  • 公开/公告号JP2016100430A

    专利类型

  • 公开/公告日2016-05-30

    原文格式PDF

  • 申请/专利权人 MITSUBISHI MATERIALS CORP;

    申请/专利号JP20140235438

  • 发明设计人 TERASAKI NOBUYUKI;NAGATOMO YOSHIYUKI;

    申请日2014-11-20

  • 分类号H01L23/36;H01L25/07;H01L25/18;

  • 国家 JP

  • 入库时间 2022-08-21 14:45:34

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