基于C-mount封装的半导体激光器热特性模拟分析

摘要

This paper analyzed the theory of thermal characteristics of semiconductor laser and established the physical model of heat dissipation of semiconductor laser of C-mount packaging. Using finite element software of ANSYS to simulated thermal characteristic of semiconductor laser in steady-state, analyzed two methods of modeling including modeling of ANSYS self and external introduction,and discovered the former is more accurate. By changing the thick-ness of heat sink of C-mount,the article obtained the regulation of chip temperature,analyzed the cause from the per-spective of heat flow. In the end,a kind of compound heat dissipation structure is designed by introducing the diamond film and the graphene film with good thermal conductivity.%通过对半导体激光器热特性以及散热方式的理论分析，建立了C-mount封装半导体激光器的物理散热模型，针对其在稳态工作条件下的热特性，利用ANSYS有限元软件进行了模拟分析，对ANSYS自建模与外部导入两种建模方式进行分析，发现自建模方式更加精确。通过改变C-mount热沉的厚度，得到了芯片温度的变化规律，并从热流的角度进行分析。最后，通过引入导热性能良好的金刚石膜与石墨烯膜，设计了一种较为理想的复式散热结构。