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Considerations in the simulation of large monolithic microwave integrated circuits enclosed in a conducting package.

机译:模拟封装在导电封装中的大型单片微波集成电路时的考虑因素。

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摘要

This thesis presents a numerical and experimental analysis of MMIC circuits enclosed in a conducting package. Three different simulation techniques are developed: a full-wave method of moments (MOM) procedure, a simple circuit model and the enhanced diakoptic method.; In the design of MMICs, the effect of enclosing the circuit is typically assumed to be negligible. However, as the electrical size of enclosures increase package resonances are possible. If the system operates at frequencies near one of these resonances, coupling between the fundamental microstrip mode and the resonant mode is possible. This phenomenon is referred to as parasitic coupling to a resonant mode and its importance is emphasized in this thesis.; An experimentally verified full-wave MOM procedure is used to examine some of the fundamental aspects of resonant mode coupling. In addition, methods of reducing this coupling will also be investigated. For example, both the addition of loss to an enclosure or layout modifications can be used to reduce resonant mode coupling.; Since a full-wave analysis, although rigorous, is also very complex to implement, a simple circuit model is developed to describe resonant mode coupling. Simple analytical expressions for the entire model are easily evaluated, making this is a very attractive feature for implementation into a CAD package. In addition, it requires several orders of magnitude less CPU time than the MOM.; As the size of MMIC circuits increase they become too complicated to analyze using a straightforward full-wave approach. A full-wave analysis of a typical MMIC of moderate complexity may require the solution of a large system of equations. Therefore, as second alternative to the MOM the diakoptic method is modified to analyze an MMIC in an enclosure. For very large circuits significant CPU savings result. A new spectral filtering technique, called the enhanced diakoptic method, is developed to improve accuracy.
机译:本文提出了封装在导电封装中的MMIC电路的数值和实验分析。开发了三种不同的仿真技术:全波矩量法(MOM)程序,简单电路模型和增强型透光法。在MMIC的设计中,通常将电路封闭的影响忽略不计。然而,随着外壳的电气尺寸增加,封装谐振成为可能。如果系统在这些谐振之一附近的频率下运行,则基本微带模式和谐振模式之间可能会耦合。这种现象被称为寄生耦合到谐振模式,在本文中强调了它的重要性。经过实验验证的全波MOM程序用于检查谐振模式耦合的一些基本方面。另外,还将研究减少这种耦合的方法。例如,增加外壳的损耗或修改布局都可用于减少谐振模式耦合。由于全波分析虽然严格,但实现起来也非常复杂,因此开发了一种简单的电路模型来描述谐振模式耦合。可以轻松评估整个模型的简单分析表达式,这对于将其实现为CAD软件包来说是一个非常有吸引力的功能。此外,与MOM相比,它需要的CPU时间要少几个数量级。随着MMIC电路尺寸的增加,它们变得过于复杂,以至于无法使用简单的全波方法进行分析。对中等复杂度的典型MMIC进行全波分析可能需要求解大型方程组。因此,作为MOM的第二种替代方法,改进了透光法以分析机柜中的MMIC。对于非常大的电路,可节省大量CPU。为了提高精度,开发了一种新的光谱滤波技术,称为增强的透光法。

著录项

  • 作者

    Burke, John Joseph.;

  • 作者单位

    University of Massachusetts Amherst.;

  • 授予单位 University of Massachusetts Amherst.;
  • 学科 Engineering Electronics and Electrical.
  • 学位 Ph.D.
  • 年度 1993
  • 页码 227 p.
  • 总页数 227
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 无线电电子学、电信技术;
  • 关键词

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