Simulation Study on Thermal Characteristics and Thermal Stress of Semiconductor Laser Package

摘要

In semiconductor lasers, chip heat dissipation is a hot topic in current research. The increase in chip temperature will not only affect the service life of the laser, but also the thermal stress will reduce the reliability of the laser. To solve this problem, this research starts with the bonding layer between the laser chip and the substrate, uses nano-silver solder paste with high thermal conductivity as the bonding material, and uses the finite element analysis method to simulate the heat dissipation and stress distribution of the semiconductor laser at room temperature. At the same time, under the different heat consumption of the laser chip, the heat dissipation performance of the nano-silver solder and the commonly used AuSn and In solders was compared. The results show that the use of nano-silver solder paste is more conducive to the heat dissipation of the laser chip, and can effectively reduce the thermal stress of the laser chip. The research method proposed in this paper illustrates the feasibility of using nano-silver solder paste as the bonding material between the laser chip and the heat sink, and provides a reference for the design of semiconductor laser packaging.