SEMICONDUCTOR DEVICE, THERMAL STRESS DETECTOR FOR SEMICONDUCTOR DEVICE, AND METHOD OF DETECTING THERMAL STRESS OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To automatically detect a thermal stress applied to a semiconductor device without using a color image processing.;SOLUTION: The semiconductor device 1 includes a package 2 and a thermal stress detecting portion 10 having a melting part 11 which deforms by melting when applied with a thermal stress of a predetermined temperature or higher and being exposed to the outside of the package 2. By determining whether the melting part 11 is deformed or not, it is possible to detect whether the thermal stress of the predetermined temperature or higher has been applied to the semiconductor device 1 or not. Thus, the thermal stress of the semiconductor device 1 can be automatically detected without using the color image processing.;COPYRIGHT: (C)2011,JPO&INPIT