SDB-SOI晶片减薄技术综述

摘要

In this paper,the characteristics and requirements of SDB-SOI thinning technology were described.Chemical mechanical polishing,electrochemical etch-stop,plasma stripping polishing techniques and smart-cut were introduced.The SDB-SOI wafer thinning trends was proposed.%阐述了SDB-SOI晶片的减薄技术的特点和要求,依次介绍了化学机械抛光、电化学自停止腐蚀、等离子抛光技术和智能剥离技术的原理和特点,并指出了SDB-SOI晶片减薄的发展趋势。