晶圆超精密磨削加工表面层损伤的研究

摘要

介绍了晶圆减薄机的工艺过程和原理,研究了磨削工艺中砂轮粒度、砂轮进给率、砂轮转速和工作台转速对硅片表面层损伤深度的影响.%In this paper,the process and principle of the w afer grinding machine are introduced,the effect of the grinding wheel type,the wheel infeed rate,the w heel rotation speed and the chuck rotation speed on the wafer surface layer dam age are studied.