高速高密度PCB的RE问题

摘要

随着数字产品的时钟频率越来越高,信号上升时间（下降时间）越来越短,PCB的RE越来越严重,已逐步成为影响产品EMC性能的重要因素之一,PCB设计过程中必须采取综合措施抑制RE。从高速高密度PCB设计的角度,总结了PCB级RE的主要来源,分析了PCB级RE的基本规律,给出了PCB级RE的抑制对策。讨论与结论对高速高密度PCB设计实践具有参考作用。%RE（radiated emission） in high-speed and high-density PCBs is becoming more and more important for modern digital products.The RE has key impacts on EMC（electromagnetic compatibility） of the products and it＇s critically important to fix the RE problems in high-speed and high-density PCB designs.On the purpose of high-speed and high-density PCB designs and at the level of PCB,the main sources of the RE are outlined,the mechanisms and characteristics of the RE are analyzed,and the reduction techniques for the RE are characterized.The discussions and conclusions are useful for guiding the high-speed and high-density PCB design practices.