METHOD FOR MANUFACTURING SUBSTRATE OF CERAMICS PCB USING HIGH RATE AND HIGH DENSITY MAGNETRON SPUTTERING WAY

摘要

A method for manufacturing a substrate of a ceramic PCB by using a high rate and high density magnetron sputtering method is provided to adjust the thickness of cooper film to 1-500 micrometer in the fabrication of a substrate of a ceramic PCB by solving the problems of heat bonding with a high rate and high density magnetron sputtering method and to increase bonding strength. A method for manufacturing a substrate of a ceramic PCB by using a high rate and high density magnetron sputtering method comprises the steps of: preparing a substrate made of ceramic material including Al2O3, AIN, BN, BeO, etc.; forming an adhesive layer on the surface of the substrate by using a magnetron sputtering method; forming first thin film, which has compressive residual stress or tension residual stress, on the upper plane of the adhesive layer by using a high rate and high density magnetron sputtering method; forming a second thin film, which has compressive residual stress or tension residual stress, on the upper plane of the first thin film by using the magnetron sputtering method; and stacking the first thin film and the second thin film alternately.