Reactive magnetron sputtering for coating substrates by target of magnetron, comprises arranging substrate opposite to magnetron, atomizing target material by sputtering and depositing sputtered target material to substrate

摘要

Reactive magnetron sputtering for coating substrates by a target of a magnetron, comprises arranging a substrate, which is to be coated, opposite to the magnetron, atomizing the target material by sputtering and depositing the sputtered target material in the presence of a reactive gas to a substrate. The plasma is ignited between the substrate and the magnetron for atomization. The ignition point of the plasma is forced by means of the magnetic system of the magnetron on a self-closed track, preferably an erosion trench. The magnetic system is operated asymmetrically. Reactive magnetron sputtering for coating substrates by a target of a magnetron comprises arranging a substrate, which is to be coated, opposite to the magnetron, atomizing the target material by sputtering and the depositing the sputtered target material in the presence of a reactive gas to a substrate. The plasma is ignited between the substrate and the magnetron for atomization. The ignition point of the plasma is forced by means of the magnetic system of the magnetron on a self-closed track, preferably an erosion trench. The magnetic system is operated asymmetrically. The magnetic flux density in a first magnetic field above a first section of the erosion trench is higher than that in a second magnetic field over a second portion of the erosion trench. An independent claim is also included for a device for reactive magnetron sputtering, comprising the magnetron with the target, which is to be atomized, of the coating material with a cutting surface, the magnetic system on the side of the target facing away from the cutting surface for generating a closed loop magnetic tunnel, which is adjacent to the cutting surface, and a plasma device with the electrode arrangement for generating a plasma ring above the cutting surface, where the magnetic system comprises at least two mutually opposite sections of magnets with different shape and/or material in the magnetic flux density.