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首页> 外文期刊>Journal of Electronic Materials >The Effects of Substrate Bias,Substrate Temperature,and Pulse Frequency on the Microstructures of Chromium Nitride Coatings Deposited by Pulsed Direct Current Reactive Magnetron Sputtering
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The Effects of Substrate Bias,Substrate Temperature,and Pulse Frequency on the Microstructures of Chromium Nitride Coatings Deposited by Pulsed Direct Current Reactive Magnetron Sputtering

机译:衬底偏压,衬底温度和脉冲频率对脉冲直流反应磁控溅射沉积氮化铬涂层微观结构的影响

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摘要

Recently,great attention has been devoted to the pulsed direct current(DC)reactive magnetron sputtering technique,due to its ability to reduce arcing and target poisoning,and its capability of producing insulating thin films.In this study,chromium nitride(CrN)coatings were deposited by the bipolar symmetric pulsed DC magnetron reactive sputtering process at different pulse frequency,substrate bias voltage,and the substrate temperature.It was observed that the texture of CrN changed from(111)to(200)as substrate temperature increased to 300 deg C as deposited at 2 kHz without substrate bias.With increasing pulsing bias and pulse frequency of target,predominated(200)orientation of CrN film was shown due to the ion bombardment/ channeling effect to preferentially sputter those unaligned planes.For the CrN coatings deposited with pulsed biasing,the grain size decreased with increasing pulse frequency and substrate bias,whereas the surface roughness showed a reverse trend.The deposition rate of the CrN films decreased with increasing pulse frequency.It was concluded that the pulse frequency,substrate bias,and substrate temperature played important role in the texture,microstructure,and surface roughness of the CrN coatings deposited by the pulsed DC magnetron sputtering process.
机译:近年来,由于其减少电弧和靶中毒的能力以及产生绝缘薄膜的能力,人们对脉冲直流(DC)反应磁控溅射技术给予了极大的关注。在本研究中,氮化铬(CrN)涂层通过双极对称脉冲直流磁控反应溅射工艺在不同的脉冲频率,衬底偏置电压和衬底温度下进行沉积。观察到随着衬底温度升高至300度,CrN的织构从(111)变为(200)。 C以2 kHz的速率沉积而没有衬底偏压。随着脉冲偏压和靶脉冲频率的增加,由于离子轰击/沟道效应优先溅射那些未取向的平面,显示出CrN膜的主要(200)取向。在脉冲偏压下,晶粒尺寸随着脉冲频率和衬底偏压的增加而减小,而表面粗糙度则呈现相反的趋势。随脉冲频率的增加,CrN薄膜的厚度减小。结论:脉冲频率,衬底偏压和衬底温度在脉冲直流磁控溅射工艺沉积的CrN涂层的织构,微观结构和表面粗糙度中起重要作用。

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