Numerical Modeling of Electrical Resistance of Interconnections in High-Tech Multilayer PCBs Manufactured by Magnetron Sputtering Deposition of Copper

摘要

In the paper, authors focus on application of numerical simulation methods along with the experimental measurements to access the electrical resistance of interconnections in PCB (Printed Circuit Board). The comparison of experimental and numerical results allow to define the design rules of interconnection properties and specification of interconnection and technology details depending on the selected application. Additionally, it is believed to allow course prediction of deposition process of conductive layer on via walls, without necessity of performing costly and time consuming experiments. In the paper authors present results and investigations which should lead to manufacture interconnections with aspect ratio (relation of via deep to via diameter) higher than 1, and diameter of via in the range of 25 to 150 驴m.