低银无铅焊料的研制动态

摘要

The advantages of low-Ag lead free solders (w(Ag) ≤ 1.0%) are analyzed from aspects of cost, amti-dropping capability, and Ag3Sn forming in the solder bulk by comparing to those of high-Ag lead free solders. Some problems of low-Ag lead free solders in application, such as high melting point, thermal fatigue property, rework defects, are summarized, and some solutions are presented. Finally, the prospects of low-Ag lead free solders are proposed.%分析了低银无铅焊料(w(Ag)≤1.0％)在成本、抗跌落性能、Ag3Sn化合物的形成等方面与高银焊料相比的优势,综述了低银焊料在应用过程中面临的问题,如高熔点与氧化、热疲劳性能、返修缺陷等,并列举了实例,提出了一些有针对性的解决方案.最后展望了低银无铅焊料的发展趋势.