类球形金粉粒径对Au-金属化低温共烧陶瓷微观结构及翘曲度的影响

摘要

The shrinkage behavior of low temperature co-fired ceramics (LTCC) during cofiring process and the main factors having an effect on cambering of metallized LTCC ceramics after cofiring were investigated. Six kinds of near-sphere gold powders with different average diameters, ranging from 0.7 μm to 2.3 μm, were chosen to formulate gold conductivepastes together with a proper organic vehicle and glass frit. The pastes were printed on LTCC green tapes, laminated and cofired according to conventional LTCC process. The microstructure and cambering of each ceramic,sheet resistance of each pastewere measured and calculated respectively. Experimental results show that pastes formed with large particle size gold powder have advantages in bringing down the cambering extent of the ceramic, but the film shows poor sintering and densification as well as high sheet resistance.%研究和探讨了低温共烧陶瓷(LTCC)共烧过程中的收缩现象及LTCC陶瓷金属化后翘曲的主要影响因素.采用六种不同平均粒径(0.7~2.3μm)的类球形金粉、玻璃粉及一种合适的有机载体分别制备成金导体浆料.将制备成的金导体浆料印刷在LTCC生瓷膜上,按LTCC常规工艺叠层、共烧.分析了不同粒径金粉制备的浆料印刷在瓷片上烧结后的微观结构,测量了各瓷片的翘曲度及各浆料的方阻.实验发现采用大粒径的类球形金粉有利于减小瓷片的翘曲度,但烧结膜层致密性变差,方阻也变大.