氮气流量对反应磁控溅射TiN薄膜微结构与力学性能的影响

摘要

利用磁控溅射镀膜技术分别在硬质合金YG6X和单晶Si片表面制备TiN薄膜,分析N2流量对薄膜相组成、表面形貌、显微硬度和膜基结合力的影响.结果表明,N2流量对薄膜的微结构以及力学性能具有重要影响.随着N2流量的降低,TiN薄膜表面孔洞和台阶明显减少,表面平整度得到明显改善；薄膜的物相组成在N2流量为0.2sccm时为TiN和TiN0.61两相；N2流量的变化改变了薄膜表面的能量状态,因此,降低N2流量导致TiN薄膜的生长取向由(200)面向(111)面转变.同时,N2流量为2.4 sccm时TiN薄膜的膜基结合力最高,此时TiN薄膜也具有最高的显微硬度.%TiN films were deposited on YG6X and single crystal Si substrate by magnetron sputtering. The effect of nitrogen flux on the phase composition, surface morphology, microhardness and adhesion strength was discussed. The results show that the microstructure and mechanical properties are significantly affected by the nitrogen flux. The surface of the film becomes increasingly smooth with reduced amount and sizes of voids while decreasing the flux of nitrogen. The film is composed of TiN and TiNau for the nitrogen flux of 0.2 seem. The growth orientation of the TiN film transforms from (200) to (111) with the decreasing of nitrogen flux due to the varied energies of deposited particles. The nitrogen flux with value of 1.2 seem results in the maximum adhesion with the substrate, and also the maximum hardness.