Integrated CMOS electronic drivers for large scale metal MEMS mirror arrays using linearization techniques.

摘要

Spatial light modulators (SLM) are micromachined MEMS (micro-electro-mechanical-systems) devices that can modulate light by reflecting light rays at different phases. These devices when formed into a large-scale array can be used for high speed optical and secure optical communications by modulating the light rays' phase. With the advances in MEMS fabrication technology, it has become inexpensive to produce large scale minor arrays, which are more efficient than traditional LCD (liquid crystal display) based systems.; The MEMS mirror arrays are fabricated on silicon substrates and there is a need to design the necessary electronics that control the operation of these minor arrays. The requirements of these electronic drivers have pushed towards the development of IC (Integrated Circuits) fabrication processes that allow operation at much higher voltages than traditional devices. These processes have made it possible to integrate electronic drivers together with MEMS devices on one substrate to form a compact and efficient system. In the past, MEMS mirror drivers were large in size and had limited functionality. During the last decade, various methods were developed to produce smaller and more proficient systems. The approach presented here led to a pixel design that is compact and scalable, which makes it suitable to form a large-scale array. In addition, the driver incorporates a linearization scheme that compensates for the non-linear relationship of minor deflection to the applied voltage, which is an inherent issue with an electrostatic-activated device.; The challenges of making an integrated system of MEMS and IC are small area requirements, incorporation of low and high voltage devices, and high voltage switching techniques. In this dissertation, multiple development stages of a large scale SLM driver ranging from a simple 4 by 4 array to 160 by 160 are designed, built and tested. This work involved testing the possibility of integration at early stages leading to a functioning large scale integrated system of IC and MEMS devices.