超微间距全自动金线焊接机的工艺优化技术
PARAMETER OPTIMIZATION OF ULTRA-FINE-PITCH WIRE BONDING PROCESS
摘要
ABSTRACT
ACKNOWLEDGEMENTS
CONTENTS
NOMENCLATURE
LIST OF TABLES
LIST OF FIGURES
INTRODUCTION
1.1 Background and Motivation
1.3 Purpose of the Research
1.4 Overview
WIRE BONDING PROCESS AND PERFORMANCE TEST
2.1 Wire Bonding Process
2.2 Wire Bonding Test
2.3 Conclusion
TAGUCHI METHOD
3.1 Taguchi Method
3.2 Summary
EXPERIMENTS AND PROCESS OPTIMIZATION
4.1 Introduction
4.2 Observation about Transformation of Ball Shearing Force before and after Wire Pulling Test
4.3 FAB Size Control
4.4 Loop Control
4.5 Optimization of Wire Bonding Process Parameters Setting
4.6 Conclusion
CONCLUSION AND FUTURE WORK
5.1 Conclusion
5.2 Future work
哈尔滨工业大学硕士学位论文原创性声明
哈尔滨工业大学硕士学位论文使用授权书
REFERENCES