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Comparison of high field characteristics of SiO_2 and AIN gate insulators in 6H SiC MOS capacitors

机译:6H SiC MOS电容器中SiO_2和AIN栅极绝缘体的高场特性比较

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摘要

Using a fast ramp response technique, the high field characteristics, specifically the breakdown strength, of thermally grown silicon-dioxide (SiO_2) and MOCVD grown aluminum-nitride (AlN), on n-type 6H-SiC epilayers is obtained as a function of three different procesing conditions for the insulator grwoth. Significant improvement in the breakdown strength of thermally grown SiO_2 after a 30 minute post annealing at 400 deg in nitrogen ambient is reported. Further, the influence of temperature profile during the AlN growth on the breakdown strength is reported.
机译:使用快速斜坡响应技术,可以得到n型6H-SiC外延层上热生长的二氧化硅(SiO_2)和MOCVD生长的氮化铝(AlN)的高场特性,特别是击穿强度。绝缘子的三种不同加工条件。据报道,在氮气环境中,在400度下退火30分钟后,热生长的SiO_2的击穿强度有了显着改善。此外,据报道AlN生长期间温度分布对击穿强度的影响。

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