首页> 外文会议>VLSI Technology, Systems, and Applications (VLSI-TSA), 2012 International Symposium on >Embedded Metal Source/Drain (eMSD) for series resistance reduction in In0.53Ga0.47As n-channel Ultra-Thin Body Field-Effect Transistor (UTB-FET)
【24h】

Embedded Metal Source/Drain (eMSD) for series resistance reduction in In0.53Ga0.47As n-channel Ultra-Thin Body Field-Effect Transistor (UTB-FET)

机译:嵌入式金属源/漏(eMSD),用于降低In0.53Ga0.47As n沟道超薄体场效应晶体管(UTB-FET)中的串联电阻

获取原文
获取原文并翻译 | 示例

摘要

We report a novel n-channel Ultra-Thin Body Field-Effect Transistor (UTB-FET) comprising an embedded Metal Source/Drain (eMSD) formed in a quasi-insulating InAlAs region. The InAlAs barrier layer reduces off-state leakage current IOFF significantly. The eMSD consists of conductive Ni-InGaAs and Ni-InAlAs layers, and has a low sheet resistance Rsh of ∼20 Ω/square. This achieves a significant reduction in the parasitic S/D resistance Rsd, as compared with a conventional UTB-FET with thin S/D.
机译:我们报告了一种新型的n沟道超薄体场效应晶体管(UTB-FET),其中包括在准绝缘InAlAs区域中形成的嵌入式金属源极/漏极(eMSD)。 InAlAs阻挡层可显着降低截止态泄漏电流IOFF。 eMSD由导电Ni-InGaAs和Ni-InAlAs层组成,具有约20Ω/平方的低薄层电阻Rsh。与具有薄S / D的传统UTB-FET相比,这实现了寄生S / D电阻Rsd的显着降低。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号