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Stability Improvement of Gallium Indium Zinc Oxide Thin Film Transistors by Post-Thermal Annealing

机译:通过热后退火改善镓铟锌氧化物薄膜晶体管的稳定性

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摘要

The effects of post-thermal annealing on the stability of Ga_2O_3-In_2O_3-ZnO (GIZO) thin film transistors (TFT) were investigated by comparing the GIZO TFTs annealed for 3 hour and for 65 hours under high-field bias stress, light illumination, and long-term storage in air. We found that the poor stability of the GIZO TFTs under these stresses was remarkably improved after 65 hours' post-thermal annealing at 250 ℃. The improvement of the stability is ascribed to the reduction of the trap sites in the GIZO layer and curing of weak atomic bonds otherwise susceptible to breaking during the stress.
机译:通过比较在高场偏应力,光照射下退火3小时和65小时退火的GIZO TFT,研究了后热退火对Ga_2O_3-In_2O_3-ZnO(GIZO)薄膜晶体管(TFT)稳定性的影响。并长期储存在空气中。我们发现,在250℃的热退火65小时后,GIZO TFT在这些应力下的不良稳定性得到了显着改善。稳定性的提高归因于GIZO层中俘获位点的减少和弱原子键的固化,否则在应力作用下容易断裂。

著录项

  • 来源
    《Thin Film Transistors 9 (TFT 9)》|2008年|309-313|共5页
  • 会议地点 Honolulu HI(US)
  • 作者单位

    Display Lab., Samsung Electronics CO. LTD, San 14-1, Nongseo-Dong, Giheung-Gu, Yongin-Si, Gyeonggi-Do, 446-712, Korea;

    Display Lab., Samsung Electronics CO. LTD, San 14-1, Nongseo-Dong, Giheung-Gu, Yongin-Si, Gyeonggi-Do, 446-712, Korea;

    Display Lab., Samsung Electronics CO. LTD, San 14-1, Nongseo-Dong, Giheung-Gu, Yongin-Si, Gyeonggi-Do, 446-712, Korea;

    Display Lab., Samsung Electronics CO. LTD, San 14-1, Nongseo-Dong, Giheung-Gu, Yongin-Si, Gyeonggi-Do, 446-712, Korea;

    Department of Electronic Engineering, Konkuk University, Hwayang-dong, Seoul, 143- 701, Korea;

    Display Lab., Samsung Electronics CO. LTD, San 14-1, Nongseo-Dong, Giheung-Gu, Yongin-Si, Gyeonggi-Do, 446-712, Korea;

    Display Lab., Samsung Electronics CO. LTD, San 14-1, Nongseo-Dong, Giheung-Gu, Yongin-Si, Gyeonggi-Do, 446-712, Kore;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 表面处理;
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