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Formation of Si-on-insulator structure by lateral solid phase epitaxial growth with local P-doping

机译:通过局部固相外延横向外延生长形成绝缘体上硅结构

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A low temperature process for silicon-on-insulator (SOI) formation is essential to realize future 3-dimonsional large scale Integrated circuit (LSI). For this purpose, lateral solid phase epitaxial growth (L-SPE) in deposited amorphous Si (a-Si) films on SiO2 has been studied recently. However, the L-SPE growth Is limited to a few ¿¿m from the seeding-area. Doping of a-Si with P atoms increased the L-SPE length to a maximum of 40 ¿¿m1). However. SOI with a high P uoncentration is not suitable to be used as a substrate for active device fabrication.
机译:绝缘体上硅(SOI)形成过程的低温工艺对于实现未来的3维大规模集成电路(LSI)至关重要。为此,近来研究了在SiO 2上沉积的非晶Si(a-Si)膜中的横向固相外延生长(L-SPE)。但是,L-SPE的生长距离播种区域只有几米。用P原子掺杂a-Si可以将L-SPE长度增加到最大40 µm。然而。具有高P浓度的SOI不适合用作有源器件制造的衬底。

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