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In-situ photoexcitation-induced suppression of point defect generation in ion implanted silicon

机译:原位光激发诱导的离子注入硅中点缺陷产生的抑制

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The formation of vacancy-relatede defects in n-type silicon has been studied immediately after implantation of He, Si, or Ge ions at 85 K using in-situ DLTS. A -center concentrations in He-implanted smaples reach a maximum immediately after implantatio, whereas, with Si or Ge ion implanted samples they continuously increase during subsequent anneals. It is proposed that defect clusters, which emit vacancies during anneals, are generated in the collision cascades of Si or Ge ions. An illumination-induced suppression of A-center formationis seen immediately after implantation of He ions at 85 K. This effect is also observed with Si or Ge ions, but only after annealing. The suppression of vacancy complex formation via photoexcitation is believed to occur due to an enhanced drecombination fo defects during ion implantation, and results in reduced number of vacancies remaining in the defect clusters. In p-type silicon,a reduction in K-center formation and an enhanced migration of defects are concurrently observed in the illuminated sample implanted with Si ions. These observations are consistent with a model where the injection of excess carriers modifies the defect charge state and impacts their diffusion.
机译:在使用原位DLTS在85 K下注入He,Si或Ge离子后,立即研究了n型硅中空位相关缺陷的形成。注入氦后的金属片中的中心浓度在注入后立即达到最大值,而注入硅或锗离子的样品在随后的退火过程中会不断增加。有人提出,在退火过程中会在Si或Ge离子的碰撞级联中生成空位的缺陷簇。在85 K下注入He离子后,立即可以看到照明诱导的A中心形成的抑制。对于Si或Ge离子,也只能在退火之后,观察到这种效果。据信通过光激发抑制空位络合物形成是由于离子注入过程中缺陷的重组增强,并导致缺陷簇中剩余的空位数量减少。在p型硅中,在注入了Si离子的照明样品中同时观察到K中心形成的减少和缺陷迁移的增强。这些观察结果与模型相吻合,在模型中注入过量载流子会改变缺陷电荷状态并影响其扩散。

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