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6H and 4H-SiC Bulk Growth by PVT and Advanced PVT (APVT)

机译:PVT和高级PVT(APVT)的6H和4H-SiC块体生长

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摘要

Ⅱ-Ⅵ, Inc. is a commercial supplier of high-quality SiC substrates (including 2-inch and 3-inch diameter) for RF and power applications to the US market. Semi-insulating 6H-SiC single crystals, doped with vanadium and undoped (vanadium-free), as well as n-type 4H crystals have been grown using the PVT and Advanced PVT (APVT) growth techniques. The APVT process incorporates insitu synthesis and growth of of SiC crystal from Si and C precursors. Grown 6H-SiC and 4H-SiC crystals have been extensively characterized with respect to their purity, crystal quality and electrical properties. COREMA resistivity maps demonstrate that V-compensated boules exhibited axially and radially uniform resistivity around 10~(11) Ω·cm at room temperature. Undoped (V-free) wafers contained residual boron and nitrogen at levels below 10~(16) atoms/cm~3, and demonstrated semi-insulating properties (resistivity between 10~6 and 10~(11) Ω·cm) as a result of compensation by native point defects with deep levels in the bandgap. The undoped semi-insulating crystals grown by APVT contained boron and nitrogen at 1.9·10~(15) cm~(-3) and 3.8·10~(15) cm~(-3), respectively. High-quality 2-inch SiC wafers exhibited micropipe densities on the order of 10 cm~(-2) and dislocation density on the order of 10~4 cm~(-2).
机译:Ⅱ-Ⅵ,Inc.是向美国市场提供射频和功率应用的高质量SiC基板(包括2英寸和3英寸直径)的商业供应商。掺杂有钒和未掺杂(不含钒)的半绝缘6H-SiC单晶以及n型4H晶体已使用PVT和高级PVT(APVT)生长技术进行了生长。 APVT工艺包括从Si和C前驱体原位合成和生长SiC晶体。生长的6H-SiC和4H-SiC晶体在纯度,晶体质量和电性能方面已得到广泛表征。 COREMA电阻率图表明,在室温下,V补偿的圆棒在10〜(11)Ω·cm左右具有轴向和径向均匀的电阻率。未掺杂(不含V)的晶片中残留的硼和氮的含量低于10〜(16)原子/ cm〜3,并表现出半绝缘特性(电阻率在10〜6和10〜(11)Ω·cm之间)。带隙深的自然点缺陷补偿的结果。 APVT生长的未掺杂半绝缘晶体分别含有硼和氮,分别为1.9·10〜(15)cm〜(-3)和3.8·10〜(15)cm〜(-3)。高质量的2英寸SiC晶片的微管密度约为10 cm〜(-2),位错密度约为10〜4 cm〜(-2)。

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