首页> 外文会议>Symposium on Defect and Impurity Engineered Semiconductors and Devices III, Apr 1-5, 2002, San Francisco, California >Influence of substrate surface morphology on defect generation during silicon carbide single crystal growth
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Influence of substrate surface morphology on defect generation during silicon carbide single crystal growth

机译:衬底表面形态对碳化硅单晶生长过程中缺陷产生的影响

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摘要

6H-SiC single crystals were grown on various substrates, treated mechanically and chemically in different conditions, by physical vapor transport. To investigate the defect evolution according to the different substrate treatment prior to the growth, the grown crystals were examined by optical micrograph, scanning electron microscopy, atomic force microscopy and molten KOH etching technique. The smoother substrate surface was, the lower defect density the grown SiC had. The highest quality SiC crystal was grown on substrate etched by hydrogen after polished by 0.25 μm diamond paste, having an edge/screw dislocation density of 7.3 X 10~2/cm~2 without micropipes. Defects, such as dislocations and micropipes, of the grown crystals are found to be strongly correlated with the substrate morphology.
机译:6H-SiC单晶生长在各种衬底上,通过物理气相传输在不同条件下进行了机械和化学处理。为了研究根据生长之前不同的衬底处理的缺陷演变,通过光学显微镜,扫描电子显微镜,原子力显微镜和熔融KOH蚀刻技术检查了生长的晶体。基板表面越光滑,生长的SiC具有的缺陷密度越低。最高质量的SiC晶体在用0.25μm金刚石浆料抛光后在氢蚀刻的衬底上生长,其边缘/螺钉位错密度为7.3 X 10〜2 / cm〜2,而没有微管。发现生长的晶体的缺陷,例如位错和微管,与衬底的形态密切相关。

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